8. Capacitor Discharge Bonder (2026)
Whilst designing a replacement IR energy emission element for a FTIR chemistry analyser [See Repairs: FT IR Source], I needed a bonder to weld its Kanthal A-1 [T18a] resistance wire to a solderable lead wire. EBay is flooded with cheap Chinese capacitor discharge bonders, but they are far less powerful than sellers would have you believe and those that appear to work, do so more out of creating a spark than a bond: typically their energy is in the order of 100s of mJ.
Issues highlighted in red or fuschcia still need resolving.
Deepseek AI
I brainstormed with DeepSeek AI, similar to Iron Man and JARVIS [G28] but minus the fancy virtual 3D.
I did manage to teach it how to draw an NMOSFET using text alone (it took 15 iterations!), but then it made a pig's ear of the rest of the initially trivial circuit and I abandoned this route.
DeepSeek's text description is fine with the caveat you have to question everything it says because it is often wrong, even if you state at the beginning 'do not guess, only use datasheet values' however sometimes it encounters a dichotomy in its heuristic rulebase and chooses the wrong leg. This is understandable given it is only its fifth release; in 2026, AI-assisted design is still in its infancy:
Date Version Key Changes
28/05/25 R1-0528 Enhanced reasoning, optimized front-end, reduced hallucinations
21/08/25 V3.1 Hybrid reasoning architecture, improved agent capabilities, higher efficiency
22/09/25 V3.1-Terminus Language consistency improvements, optimized Code Agent and Search Agent
29/09/25 V3.2-Exp Experimental version with enhanced capabilities
01/12/25 V3.2 Official release with high computing efficiency and balanced performance
In addition, each session is allocated 128k resource units and the closer you are to using them up the more it overwrites what you told it to begin with, resulting in incorrect answers. A simple rule of thumb is if the vertical window scroll bar is about as high as this symbol '|' you need to start a new session because once the 128k is used up, you are no longer allowed to ask it questions. Fortunately DeepSeek will provide you with a summary that you can enter to continue where you left off. Not unlike the disposable clone Mickey 17 [G29], this design got through 7 Deepseek sessions: the answers you see presented are often the conclusion of multiple iterations correcting errors that ate up the resource.
DeepSeek is very capable but a novice would find it very hard to design circuitry. As an engineer, hopefully I've spotted the pitfalls. I've both learned from it as well as enjoyed the interaction. The only downside is after I end each session, it will remember nothing it has learned if I start a new one. Thankfully sessions can be saved because having never owned an electric welder, I could not guess the physical and electrical parameters and had to start from scratch, and from first principles.
Initial assessment
I told DeepSeek I wanted to avoid high voltages and it provided an initial design assessment:
Ideal Circuit Parameters:
Voltage: 20V - 50V (Lower voltage promotes current flow over arcing).
Capacitance: 5,000µF - 20,000µF (Large capacitance for a longer pulse).
Current Limiting Resistor: Very low, just to control the peak, e.g., 10mΩ - 50mΩ.
Electrodes: Use a flat electrode on the Kanthal side and a pointed electrode on the TCW.
The flat electrode will protect the Kanthal from vaporising.
Step-by-Step Experimental Procedure: Start low at 1 Joule.
Example: With a 10,000µF cap, V = √(2 x 1 / 0.01) ≈ 14V.
Implementation
As this bonder is only required for the IR element, I'm not interested in making a full project of it that would ideally be PIC based. Instead and to save time, lab instruments provide all voltages:
Amrel PPS-1202 0-18V, 4A, 1mV rms ripple, programmable linear PSU with isolated outputs,
Manson EP-613 12V, 0.5A, 5mV rms ripple, linear PSU with isolated outputs (fixed output),
The Amrel PPS-1202 PSU charges the capacitors,
The Manson EP-613 PSU powers the drive electronics,
Required energy
I got DeepSeek to do the hard work:
Mathematically determine using existing datasets and established theory, the minimum weld energy density in Joules to bond a 0.3mm Kanthal wire to a 0.6mm tinned copper wire (TCW).
DeepSeek:
A complete model must include the energy to raise the temperature of both the TCW volume and the Kanthal volume to the bonding temperature.
Let's define the bonding temperature as the point where the TCW is molten (~1085°C) and the Kanthal is sufficiently hot for the molten copper-tin alloy to wet it and form a intermetallic bond.
We will use 1100°C as the target interface temperature.
Define the Two Volumes to be Heated:
Volume of a cylinder = π × r² × l
Where:
r is the radius of the TCW.
l is the length of the TCW cylinder being heated.
TCW Volume (V_tcw):
For 0.6mm diameter TCW and a 0.3mm bond width (the Kanthal diameter):
TCW radius r = 0.6/2 = 0.3mm
TCW length l = 0.3mm
V_tcw = π x (0.3 mm)² x 0.3mm ≈ 0.0848mm³
Kanthal Volume (V_kan):
Diameter = 0.3mm
l = 0.3mm (symmetrical)
V_kan = π x 0.15mm)² x 0.3mm ≈ 0.0212mm³
Calculate mass of TCW and Kanthal:
m = V × ρ
Where:
m is the mass of the wire volume (in grams).
V is the volume of the wire segment being heated (in mm³).
ρ is the density of the material (in g/mm³).
Mass for the TCW:
ρcu = 8.96×10−3g/mm³
mtcw = Vtcw × ρcu
Mass (m_tcw) = V_tcw x ρ_cu = 0.0848 mm³ x 8.96e-3 g/mm³ ≈ 7.60e-4g
Mass for the Kanthal:
ρkan = 7.1×10−3 g/mm³
mkan = Vkan × ρkan
Mass (m_kan) = V_kan x ρ_kan = 0.0212mm³ x 7.1e-3 g/mm³ ≈ 1.51e-4g
Calculate Energy to Heat TCW to 1100°C:
The total energy equation used was the sum of the sensible heat and latent heat required to raise the material to the bonding temperature and melt it:
Qtotal = (m × c × ΔT) + (m × L)
Where:
Qtotal is the total energy required (in Joules).
m is the mass of the material (in grams).
c is the specific heat capacity of the material (in J/g·°C).
Tinitial is my lab temperature which is usually 27°C (I like it warm).
ΔT is the temperature change, Tfinal − Tinitial (in °C).
L is the latent heat of fusion (in J/g). This term is only applied to the TCW, as it is the material that melts.
This was calculated separately for the TCW and Kanthal volumes, then summed:
Qtotal = Qtcw + Qkan
Calculate Energy to Heat TCW to 1100°C:
ΔT = Tfinal − Tinitial = 1100°C - 27°C = 1073°C
Q_heat_tcw = m_tcw x c_cu x ΔT = (7.60e-4g) x (0.385 J/g·°C) x (1073°C) ≈ 0.314J
Q_melt_tcw = m_tcw x h_cu = (7.60e-4g) x (205J/g) ≈ 0.156J
Q_total_tcw = 0.316 J + 0.156 J = 0.472J
Calculate Energy to Heat Kanthal to 1100°C:
ΔT = Tfinal − Tinitial = 1100°C - 27°C = 1073°C
Q_heat_kan = m_kan x c_kan x ΔT = (1.51e-4 g) x (0.46 J/g·°C) x (1073°C) ≈ 0.074J
Kanthal does not melt, so no latent heat is added.
Calculate Total Theoretical Minimum Energy:
Q_total = Q_total_tcw + Q_heat_kan
Q_total = 0.314J + 0.074J = 0.544J
Conclusion:
The mathematically determined minimum energy require to heat the combined volumes of both wires to a bonding temperature of ~1100°C when starting from 27°C ambient, is approximately 0.54J.
In other words, the minimum required energy is 0.54J.
We also need to know the maximum energy because we don't want to destroy it.
The optimum energy for a good bond is between the two.
Maximum permitted energy
The upper limit is defined by the point of catastrophic failure: vaporizing the wires.
Let's calculate the energy required to vaporize the bonding volume.
1Energy to Vaporize the TCW Volume (0.0848mm³):
Mass (m_tcw) = 7.60e-4g (as before)
Energy to Heat from 27°C to Boiling Point (2562°C):
ΔT = 2562°C - 27°C = 2535°C
Q_heat_to_boil = m_tcw x c_cu x ΔT = (7.60e-4g) x (0.385 J/g·°C) x (2535°C) ≈ 0.742J
Latent Heat of Vaporization (L_v,Cu):
4790 J/gQ_vaporize = m_tcw x L_v,Cu = (7.60e-4g) x (4790J/g) ≈ 3.64J
Total to Vaporize TCW: 0.742J + 3.64J = ~4.38J
Energy to Heat Kanthal to its Boiling Point (~3000°C)
Mass (m_kan): 1.51e-4g (as before)
ΔT = 3000°C - 27°C = 2973°C
Q_heat_kanthal = m_kan x c_kan x ΔT = (1.51e-4g) x (0.46J/g·°C) x (2973°C) ≈ 0.207J
Conclusion: The Maximum Energy
The total energy to begin vaporizing the materials is dominated by the TCW.
Q_max_theoretical ≈ 4.38J + 0.21J ≈ 4.6J
Safe Operating Range:
Theoretical Minimum: ~ 0.54JT
Theoretical Maximum (Vaporization): ~ 4.6J
This gives a theoretical range of ~ 0.54 to < 4.6J
'Sweet spot'
I asked DeepSeek where it thought the sweet spot for a bond might be within the range 0.54 to 4.6J:
Based on the calculated minimum (0.54J) and maximum (4.6J) energies, the sweet spot for a reliable bond will likely be in the range of 1.5J to 2.5J.
Reasoning:
Margin over Minimum (0.54J):
The theoretical minimum has no safety factor. It assumes perfect, lossless heat transfer. In reality, significant energy is lost to conduction into the cold ends of the wires, radiation, and heating the electrodes. A practical energy needs to be 2 to 3 times the minimum to ensure the bond volume actually reaches the required temperature.
This suggests an operating point above ~1.1 - 1.6J.
Safety Margin from Maximum (4.6J):
The maximum energy is a catastrophic failure point (vaporisation). A good design operates far from this cliff. A sweet spot should have a comfortable buffer, at least 40-50% below the maximum, to account for variations in hand placement, surface oxidation, and capacitor voltage tolerance.
This suggests operating below ~2.3 - 2.8J.
The overlap of these two derived ranges—'well above the minimum' and 'safely below the maximum' points directly to a sweet spot of 1.5J to 2.5J.
Required capacitance
The next step was to determine the required capacitance to bond the wires. I asked DeepSeek to calculate the capacitance for 1.5J and 2.5J at several low voltages:
C = 2E / V²
1.5J 5V 120,000µF 2.5J 5V 3200,000µF
1.5J 10V 30,000µF 2.5J 10V 50,000µF
1.5J 15V 13,300µF 2.5J 15V 22,200µF
1.5J 20V 7,500µF 2.5J 20V 12,500µF
A low ESR capacitor is essential to produce the required high peak pulse current and I would be wiring several capacitors in parallel to drop that. The best choice on eBay seemed to be Panasonic EEUFC1E222 2,200µF 25v 105C 12.5m x 35mm with ESR 22mΩ.
I then asked it to calculate for 12V: 27,777µF
27,777µ / 2,200µF = 12.6 capacitors.
The capacitors were on offer in packs of 4, so I bought 4 packs, total 35,200µF; ESR 22mΩ/16 = 1.4mΩ.
Energy at 12V: E = 0.5 x 0.0352 x (12)² = 2.53J.
To get exactly 2.5J from 35,200µF, charge it to 11.92V.
For 1.5J, charge to 9.23V.
I set the maximum voltage at 12V.
Destruction voltage
I asked DeepSeek to calculate the 35,200µF capacitor voltage at 4.6J:
E=0.5 x CV²
_______
V = / E
√ 0.5 x C
Where:
E = Energy in Joules (4.6J)
C = Capacitance in Farads (0.0352F)
V = Voltage in Volts
_____________
V = / 4.6 = 16.17V
√ 0.5 x 0.0352F
Conclusion:
To store 4.6J of energy in 35,200µF you would need to charge it to ~16.2V.
The maximum voltage of 12V gives a 26% margin of safety.
Capacitor bank safety discharge
Although the voltage isn't dangerous, the short circuit current is significant. However even though I proved empirically the Panasonic EEUFC1E222 has a long self discharge time, the voltage is critical to maintaining the optimum bond and I didn't want to add a permanent bleed resistor because it would begin to discharge the capacitors as soon as they were charged. Instead I added a manual resistive discharge circuit. I had a Welwyn W21 3W 4.7Ω resistor in stock.
The capacitor bank + is connected to the 4.7Ω W21 resistor which goes to the anode of a BT151 thyristor. The cathode of the BT151 goes to the capacitor bank -. The gate of the BT151 is connected to a small push button momentary-on switch, and its other end to the normally closed contact of a 5V reed relay.
I chose a reed relay that requires very little current to energise at 5V, which is the highest voltage I could expect to regulate from the minimum anticipated capacitor voltage. The 5V regulator shown on my schematic REV 4 is a 100mA 78L05 with a 2V dropout voltage. I will instead use a 50mA LP2950ACZ-5 with 200mV dropout, as it only has to power a 5mA reed relay.
The relay N.C. contact connects the capacitor bank + through a 1kΩ resistor and red LED into the SCR gate, satisfying both the SCR and LED current. The relay coil is energised by a +5V voltage regulator across the Amrel PPS-1202 where it enters, so the SCR cannot discharge the capacitor bank and the PSU: discharge can only take place when this PSU is off.
Deepseek ran the calcs:
Peak Current: Ipeak = 17V/4.7Ω ≈ 3.62 A
Peak Power: Ppeak = 17V²/4.7Ω ≈ 61.5 W
Discharge Time Constant: τ = R × C = 4.7Ω × 35,200µF ≈ 0.165s.
Discharge Profile:
Capacitor discharge time = V(t) = V0 x e^−T/τ
Time to 10% (~1.7V): t ≈2.3 × τ ≈ 0.38s
Time to 5% (~0.85V): t ≈3.0 × τ ≈ 0.50s
The W21 complies with EN 140401-002 which mandates the resistor must withstand 5x 3W = 15W for 5s.
We have a ~61.5W pulse for ~0.4s:
An alternative is a significantly larger 10W cermet resistor rated to 2.5x = 25W for 2.5S.
Capacitor Exponential Discharge Pulse Energy through 4.7Ω:
Edischarge = 0.5 x C x V² = 0.5 × 35,200µF ×17² ≈ 5.09J
CECC 40201-002 Qualification Constant Width Pulse Energy:
CECC discharge = P × t = 15W × 5s = 75J.
Discharging the capacitor produces <7% of this.
The SCR gate series resistor (R_G) value is calculated using the source voltage (V_source) and the required gate trigger current (I_GT).
Formula:
R_G = (V_source - V_GM) / I_GT
V_GM is the gate-cathode voltage during triggering, typically ~0.7-1.5V.
EFor a BT151 with I_GT = 10mA and a 12V source:
R_G ≈ (12V - 1V) / 0.01A = 1100Ω.
The BT151 TO-220 metal tab is big enough not to need a heatsink for the 12V/4J discharge:
Justification:
Single-Pulse, Low-Energy Event: The discharge is a single, non-repetitive event with a total energy of at most ~4J (from 17V). The average power over the discharge period is irrelevant; the critical metric is the peak surge current and the I²t rating.
Peak Current & I²t Calculation:
Peak Current (I_peak): V_max / R = 17V / 4.7Ω ≈ 3.6A
Discharge Time Constant (τ): R × C = 4.7Ω × 0.0352F ≈ 0.165s
I²t Value:
For an exponential decay, I²t ≈ (I_peak² × τ) / 2 = (3.6A² × 0.165s) / 2 ≈ 1.07A²s
Comparison with SCR Ratings (e.g., BT151-500R):
Peak Non-Repetitive Surge Current (I_TSM): 40A (typical).
I²t Rating: 6.4 A²s (typical).
The calculated values (3.6A peak and 1.07A²s) are substantially lower than the SCR's robust ratings.
The thermal mass of the SCR's silicon die alone is sufficient to absorb the single pulse of heat without a significant temperature rise necessitating a heatsink.
Capacitor bank charging current
Based on the calculation below, the Amrel current limit will be set to 1A.
Capacitor bank energy formula: t = (C × V) / I
C = 35,200µF
V = 12V (maximum)
I = 1A
t = (0.0352 × 12) / 1 = 0.4224 seconds
Capacitor bank wiring
The best way to wire a capacitor bank is to ensure wires from every capacitor are of equal length in order to minimise inductance and resistance. Star points are required but the + star point takes priority over the 0V starpoint. Deepseek puts it succinctly:
For a capacitor discharge welder, the capacitor bank positive lead star-pointed to a short cable to the tungsten electrode is significantly more critical than the ground lead star point.
Explanation:
The weld energy is delivered in a high-current pulse. The dominant parasitic element in this path is inductance (L), not resistance. Inductance opposes the instantaneous rise of current (di/dt). The voltage drop across an inductance is V = L × di/dt.
Summary:
Positive Lead (Priority): This must be the absolute shortest, most direct path possible from the capacitor bank positive terminal to the tungsten electrode. This minimises loop inductance, ensuring the fastest possible current rise time into the weld joint .
Ground Star Point (Secondary): Implement a star ground for the control and return paths (TC4422 ground, PPS-1202 negative, Manson negative) at the capacitor bank negative terminal. This isolates the sensitive gate drive from high-frequency noise created by the main discharge loop.
The capacitors are arranged as 4 columns of 4 rows: -||+ -||+ -||+ -||+, wired as quadrant corner blocks of 4 x + starpointed and & 4 x - starpointed. A 6AWG lead is split into four, and each portion connected to a 4 cap starpoint, making sure all leads are the same overall length.
Star Points
There is one 0V star point origin, which is the centralised point of the combined capacitor bank - terminals; all 0V signals are referenced to this point. The capacitor high current discharge path is thick 6AWG wire. The same is true of the + terminals which have their own Vcap star point and high current discharge path 6AWG cable.
The capacitor - is the capacitor bank - star point and central 0V star point reference.
The capacitor + is the capacitor bank + star point.
Power supplies
Thin 0V wires are separately routed from the capacitor - to the places where the incoming Amrel 0-12V and Manson fixed +12V supplies appear on the pcbs. From those points, twisted pairs of the separate 0V & 0-12V and 0V & +12V signals are carried to their respective electronics. The thinner the wire from the capacitor -, the higher the inductance and the less noise is carried to the pcbs; the psu wires are only as thick as they need to be to carry their required currents:
Wire CSA Amps Resistance Vdrop over
gauge @30°C /km /150mm 0.15m @ 1A
30AWG ~0.05mm² 0.14A ~335Ω ~55.0mΩ ~55mV
28AWG ~0.08mm² 1.0A ~216Ω ~32.4mΩ ~32.4mV
24AWG ~0.21mm² 3.5A ~88Ω ~13.2mΩ ~13.2mV
22AWG 0.33mm² 5.0A ~53Ω ~8.0mΩ ~8.0mV
Depending upon my supplies: 24AWG for the Amrel, 28AWG for the Manson and 30AWG for the sense.
However 24AWG is a convenient gauge for all.
Amrel sense wires
The Amrel PSU sense leads are twisted together and connected to capacitor+ and capacitor -. This ensures the supply protection diodes and wiring are compensated for by the PSU, and its indicated programmed voltage is present on the capacitor bank. ADD SENSE PICKOFFS TO SCHEMATIC REV 5
Charge warning LED
A 2k resistor from the capacitor + goes to the anode of a red led and its cathode to the SCR anode at the point where it joins its 4.7Ω resistor. When the button is pressed the scr turns on and the LED will illuminate indicating the capacitors have charge, and will go off when they are discharged. Although this may appear unnecessary given the fast rate of discharge, it serves to warn they are charged, without loading the bank when it is needed.
PSU supply indicators
Green LED (3.2Vf) & 2kΩ 1/4W resistor across the 12V supply from the Manson EF-613.
Green LED (3.2Vf) & 1kΩ 1/4W resistor across the 5V regulator powered by the Amrel PPS-1202.
Mosfet switch
A low side mosfet switch source connects via another 6AWG lead to the star-pointed 0V that is also the negative terminal of the capacitor bank. The NMOSFET drain leads to the negative electrode 'anvil'. A positive voltage pulse on its gate turns the mosfet on and when the positive electrode (the capacitor bank +) is placed on the wires to be welded, current flows through the weld joint and returns through the mosfet drain to the capacitor negative terminal.
ESD protection
However this configuration means the drain of the mosfet is exposed to the world, and it could be damaged by static electricity. In addition, a capacitive discharge welder acts like a large fast inductive pulse generator and induces noise spikes on power rails. To counter this and potential ESD, I placed a P6KE15CA Transient Voltage Suppressor (TVS) close to the mosfets and across the drain to 0V.
I also placed one across the capacitor bank and a fuse on its supply inlet in case the charging PSU develops a fault (don't want the capacitor bank to blow).
The P6KE15CA is a Bi-directional TVS: it clamps both positive and negative voltage spikes equally, and its 15V standoff breakdown range is 14.3V - 15.8V (capacitor voltage will be 12V max), clamp 27.2V maximum (the mosfet is rated at 30V max). It has a peak pulse power dissipation of 600W for a 10/1000µs transient waveform with a 10A peak, defined by two parameters:
t₁ (10µs): pulse rise time, measured from 10% to 90% of the peak current (I_PP).
t₂ (1ms): pulse duration, from 50% on the rising edge to 50% on the falling edge.
Essentialy this is the equivalent of a long, high-energy surge of the type you might expect with a capacitive welder. The energy from a fast ESD spike is less, but still needs to be clamped.
Normal Operation: The TVS diode is invisible. It has a very high impedance at voltages below ~14.3V.
ESD/Overvoltage Event: If a voltage spike tries to push Vgs beyond ±16V, the TVS diode instantly 'clamps' the voltage, shunting the destructive current away from fragile semiconductors.
Placement: Solder it as physically close as possible between the MOSFET source and 0V.
Mosfet selection
DeepSeek recommended using a fast 30V 240A (1050Apk) IRLB3813 NMOSFET: RDSon 1.6 mΩ max @ 10V Vgs. Its high switching current, low RDSon and relatively low 650pF typ reverse transfer capacitance, Crss, were key reasons for its selection: low Crrs allows for very fast switching with a high-current driver. For improved reliability I wired two in parallel with separate drivers.
Thermal dissipation
Absolute Maximum Continuous Current (Id) of 240A per MOSFET from the IRLB3813 datasheet, giving a worst-case combined pulse current of 480A.
Conduction Loss (P_cond):
Formula: Pcond = I² × Rds(on) × D
I_pulse: 480A
R_{ds(on)} (total for 2x MOSFETs): 0.0008Ω
Duty Cycle (D): 0.001 (10ms pulse every 10s) [10ms worst case; in reality <1ms should suffice]
Calculation: Pcond=(480)² × 0.0008 × 0.001
Pcond=230,400 × 0.0008 × 0.001=0.184W (per MOSFET)
Switching Loss (P_sw)
Formula: Esw ≈ 1² × Vds × Id × (tr+tf)
V_ds: 12V
I_d: 480A
t_r + t_f: 200ns (estimated total switching time)
Calculation:
Esw = 0.5 × 1² × 480 × (200×10−9)
Esw = 0.000576J (Joules per switching cycle)
Power: Psw = Esw × Switching Frequency
Psw = 0.0000576 W
Total Power Dissipation (P_total):
Formula: Ptotal = Pcond + Psw
Calculation:
Ptotal = 0.184 + 0.0000576
Ptotal ≈ 0.1846W (per MOSFET)
Heatsink Requirement Analysis:
Junction-to-Ambient Thermal Resistance (RθJA): 62°C/W
Temperature Rise: ΔT = Ptotal × RθJA = 0.1846W × 62 ≈ 11.4 °C
Conclusion:
A heatsink is completely unnecessary. The MOSFETs will run only slightly above ambient temperature, with a worst-case temperature rise of ~11°C.
Self-discharge protection
The Amrel PPS-1202 PSU charges the capacitors at 1A. This PSU has isolated outputs and sense inputs. I added a forward conducting diode between the PSU + and the capacitor bank + feeding back to PSU sense+. Similarly a reverse biased diode with its cathode to the PSU - and its anode to capacitor - which goes to the star pointed 0V on the NMOSFET sources and back to PSU sense- the diodes protect the PSU from damage when it is turned off and there is still charge on the capacitors; it also stops the capacitors from discharging through it. I asked DeepSeek to recommend suitable diodes, suggesting 6A.
Recommendation: FR607 6A fast recovery rectifier
Datasheet (Diodes Incorporated FR607):
Average Forward Current (I_F): 6A (at Tc=75°C).
Peak Forward Surge Current (I_FSM): 150A (8.3ms).
Repetitive Peak Reverse Voltage (V_RRM): 1kV.
Reverse Leakage Current (I_R): < 10µA at 25°C.
Package: R-6.
The R-6 is a huge 9mm dia package but it's difficult to find a smaller one at 6A, even at low voltages; Schottky diodes are unsuitable due to their high reverse leakage current.
Vcap fuse
The second channel of this PSU has a fault that drives its output to 29V [Repairs: 10 Power supplies]. To counter the channel I'm using developing the same fault, I added a P6KE15CA, 15V transzorb across the capacitor bank and a 4A polyswitch fuse where the supply comes in: MF-R400 30Vmax Ihold 4.00A Imax 40A. In the event of it triggering, its (+5V supply) green PSU LED will extinguish.
Gate driver
The NMOSFETs are each separately driven by a Microchip (formerly Telcom) TC4422 9Apk fast MOSFET driver. DeepSeek recommended the drivers be decoupled with ceramic X7R 100nF and 10µF:
The TC4422s are powered from the Manson EP-613 12V supply. I placed a MF-R050 30Vmax Ihold 0.50A Imax 40A polyswitch where the supply enters and a 1.5KE15CA TVS across the +12V physically close to the TC4422s. In the event of it triggering, the green +12V PSU LED will extinguish.
After the fuse I added two 10µF MLCs in parallel, ensuring low ESR fast current pulse decoupling.
The TC4422 datasheet recommends decoupling with 1.0µF for each 1000pF of load capacitance.
IRLB3813 input capacitance = 8420pF. Required Bulk Capacitance = (8420pF / 1000pF) x 1.0µF = 8.42µF.
Gate Driver ICs: 2 x TC4422, 9A peak, fast low side MOSFET drivers.
Local Decoupling: 10µF + 100nF MLCs (ideal for high current switching) between driver Vdd and GND.
Gate Resistors: 2.2Ω to 4.7Ω, non-inductive (carbon composition or metal film) per MOSFET gate.
Datasheet advice:
Layout: star point for gate drive connections. Keep driver IC and capacitors 1-2cm near MOSFET gates.
Pulse width
I was going to use an external variable pulse generator but the pulse width is only necessary to ensure the MOSFETs are on long enough to discharge the capacitor bank.
Discharge time constant: τ = R × C
For the 4.7Ω discharge resistor, τ = 165ms but for the weld itself, the resistance is the extremely low resistance of the MOSFETs, cables, and workpiece:
Assume total loop resistance (R_loop) ~5mΩ
τ_weld = 5mΩ × 35,200µF = 176µs
DeepSeek general information:
The minimum usable pulse width is approximately 0.2ms (200µs) for capacitor discharge welding of fine materials, though practical equipment often starts around 0.45-0.65ms depending on the application.
I chose 2ms as this satisfies both my needs and DeepSeek's advice.
Since +12V is the only constant supply, a CMOS HEF4538 dual retriggerable one-shot produces this pulse. The first one-shot Q- is wired to its positive input to force it to a *non-retriggerable one-shot. The negative input to both one-shots is from a small push switch to 0V in parallel with 1µF and with a 10kΩ pullup to +12V. The second one-shot Q- drives a white LED giving a visual indication of the weld taking place; *as it's only an LED, switch chatter extending Q2 is actually an advantage.
Component Values:
One-shot #1 (pulse): R = 20kΩ, C = 100nF time = 2ms on Q+ to TC4422.
One-shot #2 (LED): R = 10kΩ, C = 1µF time = 10ms for HE WE LED on Q- to LED cathode.
HEF4538 Iout ±3.6mA max; I'll drive the LED at 2mA.
HE WE LED 3.2Vf means 12V-3.2V/2mA = 4.4 kΩ so I'll limit its current with 5.1 kΩ to +12V.
Power up reset to clear both one-shots CLR- pin: 10kΩ to +12V & 100nF to 0V.
100nF decoupling across supply pins.
This chip is located as far away from the electrodes as possible to minimise inductive triggering, which is why there is a second pcb near the power input terminals called 'timing pcb'. Its 2ms pulse is routed to the TC4422s via miniature screened audio coax with its shield originating at the HEF4538 0V which originates at the Manson 0V star point ADD TO SCHEMATIC REV 5]; the TC4422 can accommodate large ground bounce, so is not affected. Although the TC4422 has good noise immunity, a 100pF X7R MLC filter has been added to each TC4422 input at the end of its coax.
Gate resistor
The TC4422 is capable of a 9A peak output current. The gate resistor sits between its output and the NMOSFET gate input.
Minimum Resistor for 9A with Vdd set to 12V [Manson EP-613 PSU]:
Rg = 12V = 1.33Ω
9A
Target Range (2.2Ω to 4.7Ω):
With 2.2Ω, the initial peak current is I = 12V/2.2Ω ≈ 5.45A
This is well within the driver's capability but provides strong control.
With 4.7Ω, the initial current is I = 12V/4.7Ω ≈ 2.55A
This is ideal for damping and still provides very fast switching.
The 2.2Ω to 4.7Ω range is the ideal starting point, ensuring robust performance and stability.
Resistor wattage
I asked Deepseek to calculate the maximum wattage of 2.2Ω and 4.7Ω gate resistors:
Peak Instantaneous Power (W_peak)
This is the power the instant the TC4422 switches on, when the full supply voltage is dropped across the resistor.
V_drive = 12V (from Manson PSU)
Formula: Ppeak = Vdrive²
R
Peak Instantaneous Power:
For 2.2Ω, P = 12²/2.2 = 144²/2.2 ≈ 65.5 W
for 4.7Ω, P = 12²/4.7 = 144²/4.7 ≈ 30.6 W
Average Power (W_avg) per Pulse:
This is the total energy dissipated in the resistor during one gate charge/discharge cycle, divided by the pulse width. The energy dissipated in the resistor is approximately half of the total gate energy.
Q_g (Gate Charge) = 110nC
V_drive = 12V
Energy in Gate (E_gate):
Egate ≈ 0.5 × Qg × Vdrive = 0.5 × 110×10⁻⁹ × 12 ≈ 0.66 μJ
Energy in Resistor (E_res):
Eres ≈ Egate ≈ 0.66 μJ (It shares roughly half the energy).
Pulse Width (t_pulse) (Assume a conservative 1ms):
Formula: Pavg = Eres/tpulse
Pavg = 0.66×10⁻⁶/1×10⁻³ = 0.66×10⁻³W = 0.66 mW
Conclusion:
The average power is negligible (~0.66mW) for both resistors.
The critical specification is the peak instantaneous power and the pulse handling capability.
2.2Ω Resistor: Must handle ~66W pulses.
4.7Ω Resistor: Must handle ~31W pulses.
A wirewound resistor is not suitable because it will:
Slow down the switching speed by resisting the rapid current change (dI/dt).
Cause ringing and voltage overshoot on the gate signal, which can stress or damage the gate oxide.
You must use non-inductive, pulse-rated resistors (e.g., metal oxide film or carbon composition) rated for these high peak pulses, even though the average power is tiny; a standard 1/4W carbon film resistor would be destroyed. Requirement: Must withstand a ~65W peak pulse for ~100ns.
I asked Deepseek to recommend a suitable resistor.
It suggested non-inductive Vishay PR02 2W metal film:
Analysis:
The resistor is subjected to a high-power pulse when switching the MOSFET gate. Suitability is determined not by its continuous power rating, but by its ability to absorb the pulse's energy without damage.
Calculate Pulse Energy:
Peak Power, Ppeak: 65W
Pulse Duration, tpulse: 100ns
Pulse Energy, Epulse: Ppeak × tpulse = 65 × 1×10⁻⁷ = 6.5 μJ
Compare to Resistor Thermal Capacity:
A 2W metal film resistor has a larger mass. Let's estimate 0.5 grams (5 x 10⁻⁴ kg) and a specific heat capacity similar to ceramic/glass/plastic (~800J/kg·°C).
The energy required to raise its temperature by just 1°C is:
E = m × c × ΔT = (5 x 10⁻⁴ kg) × (800J/kg·°C) × (1°C) = 0.4J
Conclusion:
The pulse energy is 6.5µJ/400mJ = 0.00001625 (or 0.001625%) of the energy needed for a 1°C rise.
This means the 6.5µJ pulse is over 61,500 times maller than the energy needed to raise the resistor's temperature by a single degree Celsius. Therefore, the Vishay PR02 0.5W resistor is perfectly suitable and will not be damaged or degraded by the 65W, 100ns gate drive pulse.
The component's thermal mass renders the brief power spike harmless.
I couldn't find reasonably priced 2.2Ω and 4.7Ω PR02s but I did find 50x 10R 5% PR02s on eBay for £4.60.
Deepseek approved of my idea to parallel them by soldering them on top of each, minimising inductance.
The large number is also beneficial in finding matching resistors out of the 5% tolerance although when I came to measure them, I found most were close to spot-on.
Deepseek now recommended starting with 5Ω:
5.0Ω (2x 10Ω in parallel): Slower, more damped, most stable.
3.3Ω (3x 10Ω in parallel): A balanced middle ground.
2.0Ω (5x 10Ω in parallel): Fastest switching, highest current, highest risk of ringing.
Start with the 5Ω configuration.
Use an oscilloscope to check the gate waveform for ringing and overshoot.
If the waveform is clean and stable, try 3.3Ω to see if you can achieve faster switching without introducing instability. Only proceed to 2.0Ω if the 3.3Ω waveform remains clean.
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Electrodes
I asked DeepSeek to recommend suitable electrodes:
Look for blue 2% Lanthanated Tungsten Electrodes, often used for TIG welding, diameter 1mm: the small mass will provide a good point for focusing current and has low thermal inertia so will heat to emission temperature faster and cool faster after the discharge, which is beneficial for pulsed operation. These usually come with flat tips and you will need to grind a pointed tip on it.
Why Lanthanated Tungsten:
It has excellent high-temperature stability, good arc characteristics, and is non-radioactive (unlike the popular but radioactive Thoriated Tungsten).
Negative electrode:
A large, flat-faced electrode. This acts as the anvil. It provides a stable, supportive backing for the
workpiece.
Initially DeepSeek was happy using the aluminium box as the negative anvil, but as the design progressed, later sessions questioned this:
Aluminium (235 W/m·K): Original baseline (1.5J-2.5J).
Copper (400 W/m·K): Sinks heat fastest, requiring the largest energy increase (~+0.5J est.).
Brass (115 W/m·K): Will sink heat slower than Aluminium.
The aluminium box presents a high and variable contact resistance. This is not the bulk resistance of the aluminium, but the high and non-reproducible surface contact resistance of the aluminium oxide layer at the microscopic points of contact with the Kanthal wire. This could lead to inconsistent weld energy delivery.
Copper does not have this issue but has a thermal conductivity 60% higher than aluminium that would likely increase the energy requirement by 0.5J, Shifting the target operational 'sweet spot' from 1.5J - 2.5J, to approximately 2J - 3J (10.7V - 13.1V), with little room for experimentation above this: if the 12V limit is now raised to 14V, that leaves only 13.6% below the 16.2V point of vaporisation.
Copper thermal conductivity is 40% greater than aluminium.
Brass thermal conductivity is 51% less than aluminium.
Brass is a better compromise as it requires less energy than aluminium and retains the safety margin.
A 3mm thick 100mm square brass sheet is secured to, but insulated from, the aluminium box.
EMI minimisation
The brass is electrically insulated from the box because a) we need a defined return path and b) we don't want EMI radiated through the box to the components inside it. The brass is bolted (M3) to the mosfet drain heatsink tabs, creating a short, low impedance path.
The entire weld current return path—MOSFET sources, capacitor negative, and anvil is contained within a very small area on the lid, minimizing parasitic inductance and ensuring a sharp, powerful pulse is delivered to the workpiece.
The return path through the brass from the electrode to the MOSFET drains is very short however the brass is relatively large in order to dissipate the heat from the weld that would melt a smaller area.
Positive electrode
1.6mm Lanthanated Tungsten; grind a small, flat tip on it ~0.5mm to 1.0mm diameter.
This small flat tip concentrates the current onto a precise spot on the wires, but the flat surface applies pressure without cutting into them.
For TIG welding electrodes, the color code for Lanthanated Tungsten is not universally standardized, but the most common conventions are:
Gold: Typically denotes 1.5% Lanthanated (EWLa-1.5)
Blue: Typically denotes 2.0% Lanthanated (EWLa-2.0)
For this micro-welding application, the Blue (2.0% Lanthanated) is the better choice.
Reasoning:
The higher lanthanum oxide content (2.0% vs 1.5%) provides slightly better electron emissivity and arc stability at lower currents. This translates to a more consistent and reliable performance for the precise, low-energy pulses in a capacitor discharge welder, giving a more forgiving and stable electrode.
Whilst searching for a 1.6mm electrode I found a 1.0mm one which Deepseek agreed was a better choice:
For your stated purpose of a discharge electrode or a robust, high-temperature point (not TIG welding), the 1.0mm blue lanthanated tungsten is a superior choice to the 1.6mm.
Sharper Tip:
A 1.0mm rod can be ground to a much finer, sharper point than a 1.6mm rod. This creates a higher electric field density, which promotes easier and more reliable arc initiation or electron emission at lower voltages.
Keeping the 1mm tip flat makes it easier for the weld arm to press down upon the wires and hold them in their place; the weight of the arm on a pointed tip on the relatively soft TCW leads could damage them.
Faster Heating/Cooling:
The smaller mass has lower thermal inertia. It will heat to emission temperature faster and cool faster after the discharge, which is beneficial for pulsed operation.
Material Suitability:
Lanthanated tungsten (blue) is an excellent general-purpose choice. It holds a sharp point well, has good electron emissivity, and is more forgiving than pure tungsten.
Durability:
The 1.0mm tip will erode slightly faster than a 1.6mm tip under identical arcing conditions however it will still last for thousands of cycles.
Electrode wiring
The wiring from the capacitor bank + to the + electrode is ~150mm long 6AWG 16mm² 5.25mm dia OD8.5mm 3.70Ω/km 3200x0.08mm flexible silicone wire (140A), ensuring minimal voltage drop and a sharp current pulse to the bond point. Its 5.25mm dia core is split and soldered into two 3mm holes in a pivoting 1/4" x 3/4" x 100mm brass electrode arm near the 1mm + electrode which is clamped in a hole recessed in a slit and tightened by a bolt.
The electrode arm pivots inside a Delrin block mounted on top of the brass plate. The - electrode (return) is a brass plate that the mosfet drains are bolted into, minimising return path resistance and inductance.
EMC
The welder generates a powerful, fast-changing magnetic field with every discharge. The earthed metal box prevents the weld field from inducing stray voltages and currents in the sensitive timing (HEF4538) and gate drive (TC4422) circuits, which could cause misfiring or erratic behaviour.
Construction
The electronics are mounted inside the lid of a large aluminium box: 210mm x 110mm x 80mm.
The box is earthed via the Amrel PPS1202 front panel earth.
The box internal height is 59mm. The box lid internal height is 16mm.
A 100mm x 100mm x 3mm thick brass sheet sandwiched between two 0.3mm fibreglass sheets sits on top.
The brass sheet is isolated from and secured to the aluminium box using nylon screws in each corner.
The electrode arm is brass 3/4" high x 1/4" wide x 100mm long and is secured to the brass sheet.
The electrode arm holds the electrode.
The 1mm electrode is held in a drilled central slit one end clamped by an M4 bolt, 2 washers & a Nyloc.
The electrode arm rotates within two Delrin vertical supports 32mm deep x 11mm thick x 65mm tall.
The electrode arm pivots on an M5x60mm screw with 1 washer each side & secured by a Nyloc.
The electrode rests on the target weld leads when its brass arm is horizontal.
A spring-loaded pin above the pivot allows the arm to be secured upward when not in use.
The Delrin vertical supports are secured by 1/4" x 1/4" x 31mm brass bars top and bottom.
2x M4x12mm bolts each side of centre fix the Delrin sides to the brass bars.
2x M4xTBDmm countersunk screws in the brass sheet pass up into and securing the brass bars.
The fibreglass sheet below the brass sheet insulates it from the box.
Power enters the lid through 4mm banana sockets on the box at the opposite end to the arm.
LEDs indicating PSU state are also at this end.
Between these is the BNC connector for external DMM / scope, connected across the capacitor bank.
The discharge push switch and its red LED are located to the left of the electrode arm.
The weld push switch and its white LED are located to the right of the electrode arm.
Pcbs
There are 2 pcbs each side of the capacitor block secured to the lid: 'timing' pcb & 'welding' pcb.
The pcbs are be hand-wired 0.1" square pad.
The pcbs measure TBC 60mm x 40mm.
The pcbs are mounted inside the box lid
The pcbs solder side face the box lid.
The pcbs are secured to the aly box lid using brass standoffs.
All electronic components are soldered to the pcbs.
Layout & wiring assembly
The 0V star point is located on the 6AWG cable at the point where all capacitor leads meet it. All 0V connections to the electronics are derived from this point.
Where +12V supply wires are exposed, they run in parallel with the 0V starpoint.
A Bulldog clip on the aly box lid end beyond the electrode is clamped & isolated from the box using 2mm thick fibreglass sheet. The bottom sheet raises its low jaw to rest on the bottom of the brass anvil. Where it meets defines where the 100mm x 100mm brass sheet starts. The bulldog is used to clamp the loose TCW ends and in turn, the rest of the element prior to welding the Kanthal to the TCW.
The MOSFETs, TC4422s and discharge circuit will be mounted on the weld pcb at the weld tip end.
The HEF4538 pulse generator and supply fuses are on the timing pcb the opposite end of the box.
The MOSFETs are located each side of the weld point in parallel and inward of the Bulldog jaw with their pins facing towards this end. One is upside down so both sources can be soldered together.
The MOSFETs are bolted to the brass sheet but isolated from the aly box, through spacers and through the pcb, where external star lock washers [Home: What they don't tell you: DIY] and Nylocs secure them. Each MOSFET's central drain pin is connected to its drain bolt via a ring crimp.
The MOSFET gate is the outermost pin and is wired to its PRO2 gate resistor that runs down the outside length of its MOSFET, where it meets its TC4422 driver output pin. The gate resistor is two PRO2s in parallel, forming 5Ω. Others may be paralleled later to fine tune.
The pulse driving HEF4538 one-shot is on the timing pcb, the two connected by coax with its shield at the TC4422 end to avoid trigger pickup. Initially the TC4422s will be in turned-pin IC sockets.
The capacitor bank is arranged as a 4 x 4 block -+ -+ -+ -+ with - towards the Bulldog clip.
The capacitors are secured to the inside of the lid by their bases using 2-sided adhesive foam.
The capacitor leads are wired as two sets of 4 equidistant starpoints, one each for + & -, from each quadrant of 4 capacitors. Each of these star points then connects with equidistant lengths of 1/4 of the 3200 strands from the 6AWG cable with heat shrink insulation over bare sections.
The 6AWG capacitor - lead runs to, spreads along and is soldered to the MOSFET source leads.
The 6AWG capacitor + lead runs to the 1/4" x 3/4" pivoting brass weld arm:
passing through the aluminium lid via a locking gland, into the pivot end of the brass weld arm, split into 2 x 2.5mm leads soldered into 3mm dia x 6mm deep holes using flux & a blowtorch.
The 6AWG + and - leads are the same length.
The 4.7Ω discharge resistor and SCR ends are wired across the capacitor bank at the point where the 6AWG emerges to be split into 1/4 leads. The resistor and SCR are be located on the weld pcb.
The power supply inputs are coloured banana sockets mounted on the far end of the box lid together with their green LEDS: RED VCAP BLACK OV, YELLOW +12V BLACK 0V.
The box is earthed via a 4mm turret connected to the Amrel PSU front panel earth socket.
Sequence of events
Initial coil build
9 turns of Kanthal A-1 are wound around the 1.2mm diameter ceramic rod and pushed together.
A Bulldog clip on a heatproof stick holds the Kanthal in place on the former.
A blowtorch is used to insulate the Kanthal windings (just outside of the blue flame: 30 secs).
TCW lead attachment
The TCW leads are wound around the 1.2mm ceramic former at each end beyond the Kanthal winding.
Preparation on welder
The Kanthal wire leads on the ceramic former are bent outward 90°.
The Kanthal wire ends are placed behind the TCW.
The assembly is laid on the fibreglass sheet with the weld point over a hole exposing the brass anvil.
THE ELECTRODE MAY BE HEAVY ENOUGH TO DO AWAY WITH THE BULLDOG:
The ends of the TCW leads (and thus the ceramic former) are clamped in place by the Bulldog clip.
The heavy brass welder arm's 1mm electrode is lowered onto the TCW where it crosses the Kanthal.
Components
2x FR607 6A fast recovery rectifier, R-6
16x Panasonic EEUFC1E222 2,200µF 25V, ESR 22mΩ, 105°C
2x NMOSFET IRLB3813 30V 240A (1050Apk), TO-220
3x P6KE15CA bi-directional 15V 600W Transzorb TVS, DO-201 [Vcap, TC4422s, Mosfets]
1x polyswitch MF-R400 30Vmax Ihold 4.00A Imax 40A for Vcap supply input
1x polyswitch MF-R050 30Vmax Ihold 0.50A Imax 40A for +12V supply input
1x SCR BT151 7.5A TO-220 to discharge the capacitor bank
2x TC4422 9A peak fast low side MOSFET driver, DIP-8
1x HEF4538 dual retriggerable one-shot [2ms pulse & weld pulse LED]
1x LP2950ACZ-5 TO-92 5V 50mA regulator 200mV dropout topower the 5mA reed relay
2x turned pic IC sockets 8-pin [TL4422 prototype]
1x turned pic IC socket 16-pin [HEF4538]
2x square pad pcbs 60mm x 40mm ESTIMATE (timer pcb and welder pcb)
2x 100pF X7R MLC at TC4422 inputs to increase noise immunity
1x 100nF X7R MLC on input to LP2950ACZ-5 LDO 5V regulator
1x 100nF X7R MLC to decouple HEF4538
1x 100nF X7R MLC on HEF4538 one-shot Q2 for 2ms to pulse white LED
3x 100nF X7R MLC across each TLC4422 12V supply and 78L05 output
1x 1µF X7R MLC for HEF4538 Q1, Q2 power-up reset
1x 1µF X7R MLC on HEF4538 one-shot Q1 for 2ms weld pulse
1x 10µF X7R MLC on output of LP2950ACZ-5 LDO 5V regulator
3x 10µF X7R MLC across each TLC4422 12V supply and 78L05 input
2x 10µF X7R MLC x2 in parallel where 12V enters the board
1x red LED, 2mA [VCAP discharge]
2x green LEDs, 2mA for Amrel PSU (+5V) & Manson PSU (+12V)
1x HE 2mA white LED for weld pulse indicator
1x 4.7Ω 3W Welwyn W21 resistor [or 10W cermet]
10x 10Ω 2W Vishay PR02 non-inductive resistors for experimental gate drive [initially 5Ω]
1x 1k0Ω 1/4W gate current limiting resistor for the SCR (and its red LED)
1x 1k0Ω 1/4W resistor for 5V green LED (3.0Vf)
1x 2k2Ω 1/4W resistor for 12V green LED (3.0Vf)
1x 2k2Ω 1/4W resistor for discharge red LED (2.1Vf)
1x 5k1Ω 1/4W resistor for 12V white LED (3.2Vf)
2x 10kΩ 1/4W resistors to pull down mosfet gates
1x 10kΩ 1/4W resistor to pull up HEF4538 EN- to +12V
1x 10kΩ 1/4W resistor to pull up HEF4538 CLR- to +12V
1x 20kΩ 1/4W resistor on HEF4538 one-shot Q2 for 2ms to pulse white LED from +12V
2x low current push switch [to activate the SCR & HEF4538 weld pulse one-shots]
1x 5V reed relay with NC contact RS 349-355 SPCO 1kΩ 5V coil
1x 1N4148 relay coil flyback protection diode
1x 78L05 +5V 100mA regulator
Miniature screened audio coax for the TC4422 inputs from the HEF4538s (~150mm x2)
6AWG 16mm² 5.25mm dia OD8.5mm 3.70Ω/km 3200x0.08mm flexible silicone wire (140A) (~150mm x2)
blue 2% Lanthanated Tungsten Electrode 1mm dia x 150mm
4mm banana coloured sockets for PSU inputs Vcap RED +12V YELLOW 2x BLACK
4mm turret socket to connect metal box to Amrel PPS1202 PSU mains earth.
BNC female chassis connector to carry VCAP to DMM or scope
Aluminium enclosure 160mm x 220mm x 80mm
Bulldog clip to secure element lead wires for welding
100mm x100mm x 2.0mm fibreglass sheet above and below Bulldog clip to clamp & isolate it from box
100mm x100mm x 0.3mm fibreglass sheet above and below brass sheet (aperture at weld point)
0.3mm fibreglass sheet (£4.45 for 5x 100x100x0.3mm) CHINA https://www.ebay.co.uk/itm/317062925116
But long delivery - try AliExpress
Delrin offcut 154x32x10mm (eBay £4) (cut to 65mm long x2)
Brass sheet 100mm square x 3mm for negative electrode anvil
Brass bar 1/4" 6.3mm x 1/4" 6.3mm x100mm [cut to 2x 31mm for Delrin block top + bot supports]
Brass bar 3/4" 19mm x 1/4" 6.3mm x100mm [weld arm]
Spring loaded release point M6x12 plunger 4mm to lock welding arm in upward position
M6 x 40 hinge bolt / sleeve bolt
Nylon screws to isolate the brass sheet from the aluminium box
General screws + spacers + washers + Nylocs
Element parts:
Kanthal A-1
1x solid ceramic rod 1.2mm x100mm for element
1x ceramic rod ID3.3mm x2 in OD10mm x 250mm long TC spacer (Ali-Express)
1x ceramic tube OD3.0 ID1.5 x100mm [inside 3.3mm TC holes]
Schematic next revision: replace 78L05 5V regulator with LDO LP2950ACZ-5
LIBS 7 P.31 schematic LIBS 7 P.33 basic layout
508j01 P1150091 REV-4 cct for bonder 22-02-26 508j03 P1150092 REV-1 bonder basic layout 22-02-26

508j02 P1140956 LIBS 7 P.20 TWC & PR02 combos


Placing the work
Method:
The pointed tungsten electrode contacts the larger lead TCW; the Kanthal is pressed against the flat brass anvil.
The weld forms at the interface of highest resistance and current density, which is the contact point between the two dissimilar wires. Placing the pointed electrode on the larger TCW and the flat electrode under the finer Kanthal is the correct method. Here's why:
Current Concentration:
The sharp point on the TCW forces the immense current to focus into a tiny area at the contact point with the Kanthal.
Controlled Heat Generation:
This creates an intense, localized hotspot precisely where you want the metals to fuse—at their junction.
Anvil Function:
The large, flat electrode under the Kanthal provides a stable, cooling backing that prevents the fragile Kanthal from being vaporized and contains the weld.
Calibration first
There will be quite a bit of experimentation first with just the wires alone to determine the best bond voltage.
Making the bond (weld)
Based on the wire's tiny cross-sectional area and the goal of a localized fusion weld without vaporization, the sweet spot is likely 1 - 2 Joules.
Reasoning:
Below 1J: Risk of a cold, brittle joint due to insufficient melting.
Above 2J: High risk of vaporizing the 0.3mm Kanthal wire at the weld point.
Test:
Start at 1J, inspect the weld (it should be a fused nugget, not a sintered powder), and increase energy in 0.2J increments until you get a strong bond.
Make the bond using a cross-wire configuration.
No Bond? Increase energy by 0.25J - 0.5J and repeat.
Weak Bond? Increase energy slightly.
Sputtering/Splash? Energy is too high. Decrease immediately
The TCW will require less energy to melt than Kanthal, so the Kanthal is the limiting factor.
Reasoning:
Melting Point:
Kanthal A-1 (FeCrAl): ~1500°C
Copper (Cu): 1083°C
Brass: 900°C to 940°C
Solder Tin (Sn): ~232°C
The tinned copper wire will soften and melt its surface coating at a much lower temperature than the Kanthal will even begin to soften. The brass anvil will remain well below its melting point because
the weld energy is highly concentrated at the wire interface and brass has excellent thermal conductivity (~115 W/m·K), spreading heat rapidly across the large anvil.
The Welding Process:
The goal is to raise the interface to a temperature where the metals fuse. The tinned copper, with its lower melting point, will become molten first. This molten alloy wets the surface of the hot Kanthal, forming a eutectic bond.
Why Kanthal is the Limiting Factor:
You must pump enough energy into the junction to get the Kanthal hot enough to be wetted by the molten copper/tin. If the Kanthal isn't hot enough, the molten solder will just bead up on it without bonding. The entire process is gated by the temperature of the higher-melting-point material.
So, the statement holds: the Kanthal's need to reach bonding temperature is the limiting factor, which is why we focus the current on it via the pointed electrode on the tinned copper side.

REPLACE ABOVE BOX WITH ONE THAT INCLUDES 6AWG
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